Vias in PCB design connect different board layers and are essential for signal routing. In HDI PCB design, choosing the right type—through-hole, blind, buried, or micro vias—impacts performance, space efficiency, and manufacturing complexity.

HDI PCB stack-ups are crucial in modern electronics, offering higher circuit density, better signal integrity, and reduced board size. Proper stack-up design enhances performance, especially in compact, high-speed embedded systems.